The application procedure is now open for European higher education institutions wishing to exhibit at the European Higher Education Fairs (EHEFs) due to take place in Kuala Lumpur, Malaysia (8-9 September 2007) and Beijing, China (20-21 October 2007). These two events are part of the series of European Higher Education Fairs funded by the European Commission’s Asia-Link programme and implemented by a consortium of European agencies: CampusFrance, DAAD, Nuffic and British Council. The EHEFs in Malaysia and China will enable higher education institutions from Europe to present their study programmes to a public of students, parents, study advisors and study sponsors. Each of the two events will be preceded by an Asia-Link Symposium on the theme of EU‑Asian cooperation. The online registration procedure will be open from early May free of charge. Participation fees for an equipped booth, booth assistant and entry in the fair catalogue:

• EHEF Kuala Lumpur, Malaysia: EUR 650
• EHEF Beijing, China: EUR 1 000

Deadline for applications: May 15 2007. European higher education fairs